Thermal Interface Material KYROVIA 8510
- One-component, reworkable
- Phase transition temperature: 45°C, thermal conductivity: 1.7 W/m·K
- Excellent thermal performance, suitable for dispensing, screen printing, or manual coating
- Thermal conduction between heat sinks and heat-generating devices, such as microprocessors, graphics processors, IGBTs, FBDIMMs/memory modules, etc.
Performance Parameters
| Product Model: | 8510 |
| Pre-Cure Properties | |
| Appearance: | White Paste |
| Viscosity (1 rpm): | 800,000~1,200,000 mPa·s |
| Viscosity (10 rpm): | 500,000~700,000 mPa·s |
| Density: | 1.8 g/cm³ |
| Post-Cure Properties | |
| Density: | 2 g/cm³ |
| Thermal Conductivity: | 1.7 W/m·K |
| Volume Expansion Rate: | 15% |
| DSC Phase Transition Temperature: | 45°C |
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Thermal Interface Material KYROVIA 8520
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