Underfill Epoxy Adhesive KYROVIA 8308
- Board-level underfill
- Low viscosity, general-purpose
- Compatible with most lead-free solders, stable electrical performance
- Suitable for chip underfill and BGA protection
Performance Parameters
| Product Model: | 8308 |
| Color: | Black |
| Viscosity: | 320 mPa·s |
| Density: | 1.15 g/cm3 |
| Hardness (Shore D): | 90D |
| Glass Transition Temperature: | 113 ℃ |
| Coefficient of Thermal Expansion Before Tg: | 171 K⁻¹ |
| Coefficient of Thermal Expansion After Tg: | 55 K⁻¹ |
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