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Two-component, addition-cure type, with a weight ratio of 1:1.
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Flame-retardant and thermally conductive, cures at room temperature and can be accelerated by heating.
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Provides ample working time, ideal for automated production.
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Excellent electrical properties, with a cured product that is soft, exhibits low stress, and minimal shrinkage.
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Highly resistant to thermal shock, ultraviolet radiation, aging, and possesses good mechanical performance.
- Suitable for encapsulation and protection of high-power electronic components, particularly module power supplies and circuit boards with stringent heat dissipation and temperature-resistance requirements.
