Organic Silicone Potting Adhesive KYROVIA 5511
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Two-component, addition-cure type, weight ratio 1:1
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Transparent and soft, with self-healing properties and excellent electrical insulation performance
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Forms an exceptionally soft material with cushioning and self-recovery after curing
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Provides stress relief to protect circuits and connectors from thermal and mechanical stresses
- Suitable for insulation and stress protection of electronic devices such as semiconductor modules, connectors, and sensors
Performance Parameters
| Component A | |
| Color: | Colorless and transparent |
| Viscosity: | 800~1200 mPa·s |
| Component B | |
| Color: | Colorless and transparent |
| Viscosity: | 600~1000 mPa·s |
| Mixing | |
| Mixing ratio (weight ratio A:B): | 1:1 |
| Viscosity after mixing: | 1000 mPa·s |
| Working time: | 30~50 minutes |
| Gelation time: | 1~2 hours |
| Curing time @80℃: | 30 minutes |
| Hardness after curing (penetration depth): | 60 |
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