Epoxy Potting Adhesive KYROVIA 8235

Weight ratio 100:15
Thermal conductivity is 1.3 W/m·K
Excellent waterproof, thermal conductive, and insulating properties
Suitable for thermally conductive potting in aerospace and semiconductor industries

Performance Parameters


Component A
Color:	White
Viscosity:	140800 mPa·s
Component B
Color:	Light yellow
Viscosity:	38.4 mPa·s
Mixing
Mixing ratio (weight ratio A:B):	100:15
Working time:	6 hours
Curing time @150℃:	1 hour
Hardness after curing (Shore D):	80D