Electronic Detonator Solution

In response to the stringent safety requirements of electronic detonators under extreme conditions such as high temperature, high humidity, and strong impact, traditional encapsulation materials often lack sufficient mechanical performance and weather resistance, along with poor process compatibility. The KYLOTE™ MBPA low-pressure injection molding process can provide customers with customized encapsulation protection solutions, ensuring long-term reliability.

OurKey Advantages

Low-pressure molding (0.1–0.7 MPa) avoids high-pressure damage to precision electronic components, making it particularly suitable for stress-sensitive capacitors and chip encapsulation.
Low-temperature injection molding (≤200°C) protects capacitors and chips from thermal damage.
Low water absorption rate (≤0.2% @7 days) reduces the risk of corrosion in high-temperature and high-humidity environments.
High adhesion and hardness ensure structural integrity even during blasting vibrations.
Resistance to environmental aging (85°C/85% RH/1000 hours), while maintaining low-temperature toughness (-40°C), enables adaptation to demanding operating scenarios such as mines and tunnels.
Rapid curing shortens the production cycle, enhances efficiency, and meets the multi-variety, small-batch customization needs of the civil explosives industry.